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Copper Plating

Accu-Labs provides a robust product offering of electrolytic copper and copper alloy plating products from a variety of electrolytes that produces deposits that range from matte to extremely bright.

Copper has many useful properties, such as ductility, conductivity, and non-magnetic deposits. It has very good throwing power and provides excellent adhesion to the base metal.

463 Grain Refiner / Anode Corroder for the Copper Plating Process

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Accu-Labs #463 is a rochelle salt replacement based liquid addition agent for cyanide copper (copper alloy) electrolytes. Accu-Labs #463 was specifically engineered to raise the anode efficiency of the electrolyte and reduce the overall rate of decomposition of cyanide.

Coprite Brightener for the Copper Plating Process

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Coprite is a liquid additive formulated to produce bright deposits from cyanide copper and brass plating solutions. Coprite improves the appearance and brightness over a wide range of current densities and is compatible with almost all existing baths.

Super-Q Cyanide Copper and Brass Plating Process

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The Super-Q Bright Cyanide Copper process produces bright, ductile, uniform copper deposits over a wide current density range, at extremely flexible operating parameters. The deposit is free of pitting and roughness, making it ideal for use as a stop-off prior to case hardening or as an undercoat for subsequent deposits. The process offers a high rate of deposition, with excellent plate distribution and performs equally as well in barrel, rack, and high-speed installations.

Carb-Out P for the Copper Plating Process

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Cyanide platers are all too familiar with the problems of carbonate build-up: poor efficiency, reduced brightness, lost production from rejects, and slow plating rates. Freezing out carbonates is unpleasant at best, and often impossible. That’s why we’ve developed Carb-Out P!

This copper plating compound is highly effective as it removes carbonates from even potassium-based solutions. Carb-Out P is ideal for both evaporative and recycling systems, and it ultimately minimizes the build-up of impurities when used for copper plating processes.

BAC-7 Bright Acid Copper Plating Process

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The Accu-Labs BAC-7 Bright Acid Copper process produces very bright and leveled deposits over a wide current density range, at extremely flexible operating parameters. The process offers high conductivity with excellent plate distribution, and performs well in barrel and rack applications.

Additional advantages include user-friendly operation and versatility, as the bright acid copper plating process allows for a wide range of concentrations and current densities.